Nathan JamesNJ
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Nathan James

@nathanjames

Physicist based in Atlanta

United States
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A physicist and materials engineer with a strong focus on applied research searching for a multidisciplinary role with room for growth in a deep-tech company. With more than 6 years of research experience and 3 years of professional working experience in multinational organizations, I have technical expertise in microelectronics fabrication, energy harvesting, energy storage and semiconductor characterization.

Experience

Istituto Italiano di Tecnologia logoIT
Current

Microelectronics PhD Resarcher

May 2021 - Present (3 years)

-Designed, fabricated and validated flexible organic micro-thermoelectric generators (TEGs) for harvesting waste-heat and powering microelectronics and sensors in the IoT
-Employed scalable high-precision techniques such as inkjet printing, laser writing and photolithography to fabricate high-density device architectures that outperform the state-of-the-art by more than an order of

Alien Technology Transfer logoAT

Project Consultant

Sep 2020 - Dec 2021 (1 year 3 months)

Conducted research, drafted and presented grant proposals, business plans and technical documents for start-up companies related to innovative technologies, specifically renewable energy and healthcare
Managed relations with worldwide project stakeholders including governmental organizations such as the European Commission, the National Institutes of Health (USA) & the NSF

General Motors Company logoGC

Battery Cell Test Engineer

Oct 2017 - Aug 2018 (10 months)

Worked on an interdisciplinary team that guided the supply chain and development of electric vehicles. Tested and analyzed performance of Li-ion cells under stress from a range of suppliers to make procurement decisions balancing performance and cost per unit. Developed a large-scale test for analyzing the hazardous constituents of vaporized electrolyte in order to meet tight regulatory deadlines.

Georgia Institute of Technology logoGT

Microelectronics Fabrication BSc Researcher

Jan 2015 - May 2017 (2 years 4 months)

Developed a novel scalable underfilling method via surface energy engineering for mitigating unwanted thermal stresses in integrated circuit (IC) packaging. Fabricated superhydrophobic Cu bond pads and hydrophilic passivation surfaces, characterized surface morphology and composition, measured contact angles, evaluated filler entrapment, characterized curing properties of epoxy-silica underfill.

Institute of Electrical and Electronics Engineers logoIE

Electrical Engineering Intern

Jan 2015 - May 2016 (1 year 4 months)

Planned logistical and technical details for solar microgrid installation at a clinic in Haiti; Collaborated with solar energy equipment manufacturers to gain technical insight and equipment donations. Traveled to Thoman, Haiti in 2016 and installed microgrid, successfully generating over 7 kW and saving the clinic over $50,000/year in diesel generator costs.

Tech stack

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