At ASML, I lead product security strategy for complex multidisciplinary lithography systems, driving Cyber Resilience Act and NIS2 alignment while embedding security-by-design across product lines.
I translate product security requirements into actionable engineering direction, coordinate IPC and hardware/software interface planning, and map cross-team dependencies affecting EUV and DUV scanner products.
Previously at Samsung Electronics' Development & Innovation Institute, I led regional software readiness across seven Latin American countries and managed 8 direct reports alongside approximately 50 indirect testers. I consolidated distributed test plans, developed test-team capabilities, and supported Python-based automation that improved test efficiency by 40%.
My background also includes coordinating embedded software validation at Continental Automotive, supported by electrical engineering education, project management training, and ongoing CISSP studies.
