
Christina Pierce
@christinapierce
Program Manager at Genentech who delivered an open-office deployment and $80K in cost savings with $700K in cost avoidance.
What I'm looking for
At Genentech, I managed projects in a GMP-compliant environment and helped bring GC and subcontractors up to GMP-Impact system design and deployment. I also designed and deployed an open-cube environment for a 180-person, 39-room office, contributing to $80K in cost savings and $700K in cost avoidance.
At Tektronix Component Solutions, I managed probe and ASIC FC/BGA packaging programs, including production launches for 8, 13, 16, and 20 GHz probes. My work enabled technology required for the ATI Performance Oscilloscope launch, with combined first-year revenue of $200M+, and helped enable a $100M+ revenue contract and $6M in expanded market share.
Earlier, as a Microelectronics Process Engineer at Tektronix Component Solutions, I created a Quick Turn Engineering Area to support non-standard builds and coordinated customer requirements, assembly processes, tooling, and schedules. At Agilent Technologies, I developed an offline epoxy dispense process for tight substrate gaps and a room-temperature soldering process for PCBA connectors.
Experience
Work history, roles, and key accomplishments
Managed a broad variety of projects in a GMP compliant environment using SmartSheets and Google Workspace. Developed and implemented creative solutions for office deployments, achieving $80k cost savings and $700k cost avoidance in 3.5 months.
Program Manager Contractor
Tektronix Component Solutions
Apr 2022 - Mar 2023 (11 months)
Managed FC/BGA package programs and derivative PCBA probe tips projects, negotiating scope changes and optimizing build timing. Wrote statements of work, risk matrices, and development plans, supporting $2M in first year revenue.
Managed NPI, NPD, and machine development projects. Re-imaged team meeting notes and projects, and deployed critical path use in Clarizen, reformatting projects for team visibility.
Program Manager
Tektronix Component Solutions
Jan 2016 - Jun 2021 (5 years 5 months)
Managed probes and ASIC FC/BGA packaging programs using MS Project. Completed production launches of multiple GHz probes, resolved supply chain issues, and enabled technology for the ATI Performance Oscilloscope with $200M+ first year revenue.
Microelectronics Process Engineer
Tektronix Component Solutions
Jun 2010 - Jul 2019 (9 years 1 month)
Created and led a Quick Turn Engineering Area, providing non-standard build support. Managed complex contracted hybrid microcircuit assembly projects, coordinating resources and documentation without Oracle or drafting support.
Packaging Engineer
Calsensors
Mar 2007 - May 2007 (2 months)
Worked as a packaging engineer for a short-term role.
Deployed offline epoxy dispense programming and developed room temperature soldering processes. Coordinated cross-functional NPI builds, tracking issues and developing solutions for future builds.
Education
Degrees, certifications, and relevant coursework
California State University, Chico
Bachelor of Science, Mechanical Engineering
Bachelor of Science in Mechanical Engineering with a minor in Chemistry.
Tech stack
Software and tools used professionally
Availability
Location
Authorized to work in
Salary expectations
Job categories
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