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a varma

@avarma

ASIC/FPGA verification engineer at Twinwing Labs, building a NASDAQ tick-to-trade FPGA system.

United States
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At Twinwing Labs Inc, I designed a low-latency FPGA tick-to-trade system that processes NASDAQ ITCH data and generates OUCH orders. The SystemVerilog design combines packet handling, an order book, trading strategies, and pre-trade risk checks.

I built its three-clock-domain architecture and packaged 14 blocks as Vivado IP-XACT IP. After synthesis and place-and-route, I fixed the worst timing paths with five pipelining changes that added no latency on the order path.

At Community Dreams Foundation, I served as Project Engineer for the Integrated Mini-SoC on VLSIVault, directing CPU microarchitecture from a single-cycle design to a five-stage pipeline. I also led eight RTL tracks and authored a Python assembler for firmware bring-up.

Earlier, at Aceic Design Technologies, I architected UVM verification for AMBA AXI4 Interconnect, SPI, and UART across more than 100 VIP components. My work helped achieve 99.8% coverage and 100% assertion closure across more than 2,000 tests.

Experience

Work history, roles, and key accomplishments

TI
Current

Hardware Design and Verification Engineer

Twinwing Labs Inc

Jun 2026 - Present (4 months)

Designed a low-latency FPGA tick-to-trade system for NASDAQ ITCH to OUCH in SystemVerilog, including a 196,608-order hashed order book and multiple strategies. Built a 3-clock-domain architecture with custom CDC IP and verified the design with cocotb/Verilator and QuestaSim testbenches.

CF

Electronics Design Engineer

Community Dreams Foundation

Aug 2025 - Jun 2026 (10 months)

Served as Project Engineer for the Integrated Mini-SoC on VLSIVault, directing CPU microarchitecture from single-cycle to a 5-stage pipeline with forwarding and hazard logic. Led 8 RTL tracks and authored a Python assembler for firmware bring-up, achieving 100+ passing tests and 2.25x cache speedup.

Illinois Institute of Technology logoIT

Research Assistant

Illinois Institute of Technology

Jun 2025 - Aug 2025 (2 months)

Designed and FPGA-implemented grain-level structural defect monitoring for aerospace components using Ultra-LeNet, a CNN for ultrasonic flaw detection, achieving ~92% accuracy. Deployed a dual-accelerator, full 32-bit floating-point design on Xilinx Zynq XC7020 via Vitis HLS with deterministic 0.27 ms inference latency.

Education

Degrees, certifications, and relevant coursework

IT

Illinois Institute of Technology

Master of Applied Science, VLSI and Microelectronics

2023 - 2025

Activities and societies: Coursework: Introduction to VLSI, Advanced VLSI Design, High-Performance VLSI, Computer Architecture, Hardware Acceleration for ML

Master of Applied Science in VLSI and Microelectronics from Illinois Institute of Technology, completed from 2023 to 2025.

SS

Shri Vaishnav Institute of Technology & Science

Bachelor of Technology, Electrical Engineering

2018 - 2021

Activities and societies: Coursework: Circuit Theory, Analog & Digital Electronics, Microprocessor & Microcontroller, Neural Networks, Data Structures & Algorithms

Bachelor of Technology in Electrical Engineering from Shri Vaishnav Institute of Technology & Science, completed from 2018 to 2021.

SC

Shri Vaishnav Polytechnic College

Diploma, Electrical Engineering

2015 - 2018

Activities and societies: Coursework: Electrical Circuits, Power Electronics & Application, Electrical Machines, Power System Operation & Protection

Diploma in Electrical Engineering from Shri Vaishnav Polytechnic College, completed from 2015 to 2018.

Tech stack

Software and tools used professionally

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