Lan Zhao
@lanzhao
I bridge semiconductor product needs with hands-on embedded development.
What I'm looking for
I’m an entry-level semiconductor and embedded professional with a communication engineering background and a focus on intelligent information and data processing. Through my coursework in C programming, data structures, signal processing foundations, and big data analysis, I built both practical engineering thinking and data-driven problem-solving habits. I also earned multiple scholarships, including the National Encouragement Scholarship.
I’ve delivered results through project work: I contributed to an intelligent epileptic seizure prediction and alert headband, aiming to provide earlier warnings for safer protection, and the work won a Challenge Cup university entrepreneurship plan competition award (school-level first prize). I also worked on a Python-based optical communication system simulation software, developing components, signal flow visualization, and integration testing with pytest to reach 85% coverage—supported by a national-level 大创 project and an “Internet+” school competition silver award.
During my 2025 internship, I developed embedded solutions on STM32F103, including a circular fan and an intelligent warehouse control system where I optimized task scheduling to reduce communication latency by 18%. I also built a multi-threaded Python + Qt monitoring interface for simulated data, and developed an embedded CAD drawing module with SkiaSharp (including line/arc algorithms and ±0.5mm path-planning outputs). Now, as a Semiconductor Chip Product Assistant, I translate customer needs into reports and sample requests, track ~40–50 customer project timelines, coordinate across sales/FAE/product/商务, and maintain accurate product-line feature data.
Experience
Work history, roles, and key accomplishments
半导体产品助理
杭州宇晔科技有限公司
Jun 2025 - Present (1 year)
对接客户需求,完成报备与样品申请工作,推进客户小批需求落地。整理并跟进约40-50条客户项目进度,协调销售、FAE、产品经理及商务资源,并维护代理半导体芯片产品特性资料。
嵌入式开发实习生
浙江立镖机器人有限公司
Mar 2025 - Jun 2025 (3 months)
基于STM32F103开发循环风扇与智能仓储控制系统,优化任务调度算法并将通信延迟降低18%。参与数据模拟引擎、CAD绘图模块开发与电路调试,输出精度达±0.5mm并验证PWM信号稳定性。
Education
Degrees, certifications, and relevant coursework
杭州电子科技大学
本科, 通信工程
2021 - 2025
Grade: GPA 3.73/5.0;专业排名前30%
Activities and societies: 荣誉:优秀学生奖学金(校三等奖)及国家励志奖学金;大创参与科技立项;第八届校“互联网+”大学生创新创业大赛校级二等奖。
全日制统招本科,通信工程专业(新工科创新班:智能信息与数据处理),GPA 3.73/5.0。期间参与校级/国家级创新竞赛与科研立项,获得国家励志奖学金与校级“互联网+”二等奖等。
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