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Jack Kennedy

@jackkennedy1

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Mechanical Field Engineer at Capstone Turbine troubleshooting and commissioning gas turbines and generators.

United States

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At Capstone Turbine, I troubleshoot, test, repair, and commission gas turbines and generators, from 60 kW to megawatt and larger generators.

I also assisted with the design and implementation of in-house remote monitoring hardware and software for a control center UI that provides greater visibility of Capstone’s assets.

At VMCIS, I designed, built, and installed test systems for industrial equipment assembly lines, using TCP/IP, Modbus, RS232, and OBD II. I also installed and commissioned complex systems, including hardware design, ladder logic programming, and software design.

At Hitachi High-Tech America, I performed more than 30 complete installations of specialized dry-etch semiconductor equipment in a class-10 cleanroom. I used engineering tools to troubleshoot across several systems and led a team of up to six engineers.

Experience

Work history, roles, and key accomplishments

Current

Mechanical Field Engineer

Current

Capstone Turbine

Apr 2025 - Present (1 year 6 months)

Used engineering methods and tools to troubleshoot, test, repair and commission Capstone gas turbines and generators. Assisted with design and implementation of remote monitoring hardware and software, and kept projects on budget and on time using systems engineering techniques.

Engineering Troubleshooting Testing Repair Commissioning Gas Turbines Generators Remote Monitoring Systems Engineering

Mechanical Engineer

VMCIS

Nov 2024 - Mar 2025 (4 months)

Designed, built, and installed test systems for industrial equipment assembly lines as part of final-out and quality assurance processes. Installed and commissioned complex test systems, including designing hardware, troubleshooting, programming ladder logic, and designing software for Fortune 100 companies.

TCP IP Modbus RS 232 OBD II Test Systems Hardware Design Troubleshooting Ladder Logic Programming Software Design

Field Engineer II

Hitachi High-Tech America

Sep 2020 - Aug 2024 (3 years 11 months)

Performed over 30 complete installations of specialized dry-etch semiconductor equipment in a class-10 cleanroom. Used FEA, CAD, and other engineering tools to troubleshoot problems with RF, software, electro-mechanical, pneumatic, thermo-fluids, and robotic systems, while leading a team of up to six engineers.

FEA CAD Radio Frequency Software Electromechanical Pneumatics Thermofluids Robotics Team Leadership Cleanroom Semiconductor Equipment

Mechanical Design Intern

Sherpa Design

Feb 2019 - Jun 2020 (1 year 4 months)

Designed parts for 3D printing with multiple types of Stereo-Lithography Resin 3D printers using Solidworks, Solidedge, and Siemens NX CAD software. Utilized Solidworks analysis tools, including FEA and molding tools, to dimension and tolerance parts for non-destructive testing, manufacturability, and 3D printability.