Black SemiconductorBS

Senior Advanced Packaging Architect (f/m/d)

Black Semiconductor GmbH is pioneering chip connectivity innovation using graphene technology to enhance data transfer and energy efficiency in computing.

Black Semiconductor

Employee count: 51-200

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We see the semiconductor industry as a realm of possibility. We see opportunities. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connectsThe semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude
In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solutionBlack Semiconductor is looking for a Senior Advanced Packaging Architect (f/m/d) to join our photonics product development team. In this pivotal role, you will architect the next generation of advanced packaged SOCs incorporating advanced CMOS processes and latest photonics innovation targeting data centers and edge AI use cases
You will be responsible for designing and implementing advanced packaging solutions for high-performance heterogeneous, silicon and photonics, SOCs using chiplet architecture. You will be foundry and OSAT interface person for advanced packaging vendor evaluation, technology selection, feasibility study, design, manufacturing, assembly, test, and qualification
  • Fully documented SOC Advanced Packaging Product Requirement Specification (PRS) per product that includes package design, verification, thermal/mechanical analysis, quality/reliability and estimations for performance and cost
  • Fully documented advanced packaging IP roadmap aligned with our technology capabilities and OSATs
  • Fully documented Customer Packaging Requirement Document (CRD) per customer engagement
  • Advanced Packaging concept and feasibility documents that describe the solution space explored and recommendation on final architecture
  • Fully documented advanced packaging ecosystem and competitive analysis
  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science is required; Master’s or PhD preferred
  • 10+ years of experience in semiconductor packaging with a focus on advanced techniques such as 2.5D/3D integration, fan-out packaging, or system-on-chip (SoC) solutions
  • 10+ years of experience with 2.5D/3D/3.5D heterogeneous integration technologies such as SoIC, CoWoS, WoW, and Photonics
  • 10+ years of experience in advanced packaging and organic substrate technology, silicon, interposer, substrate manufacturing process, assembly flow, functional and reliability test, and qualification
  • 10+ years of experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle
  • 10+ years of experience in understanding core and build-up material mechanical/electrical properties, trade-offs, CTE mismatch, TSV impact on warpage, stress, reliability, and Chip Package Interaction (CPI)
Other
  • Understanding of current silicon photonics packaging and connectivity
  • Successful customers engagement on so-architecting customer specific solutions
People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what mattersLet’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal developmentYour Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and futureWe Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward  We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry  Can you picture yourself in this Role and our Company? Let’s connect

About the job

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Job type

Full Time

Experience level

Senior

Location requirements

Open to candidates from all countries.

Hiring timezones

Worldwide

Job categories

Senior Packaging EngineerPackage Design EngineerPackaging Engineering Manager

Skills

Advanced PackagingSemiconductor PackagingCMOSIntegrated Photonics2.5D IntegrationSystem On Chips (SoCs)Heterogeneous IntegrationWafer BumpingSubstrate TechnologyElectrical PropertiesChip Package Interaction (CPI)ReliabilityBOM SelectionGrapheneBandwidth

About Black Semiconductor

Learn more about Black Semiconductor and their company culture.

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At Black Semiconductor, we connect chips and inspire innovation by revolutionizing computing through advanced technology. Our team is dedicated to addressing the pressing challenges of modern connectivity in electronics. As compute demand accelerates, traditional electrical connections often fall short, posing limitations on speed, energy efficiency, and scalability. We harness the unique properties of graphene to create a transformative approach to chip communication that integrates high-speed photonics with electronics, thus enhancing data transfer efficiency. This creates substantial reductions in latency and energy consumption.

Founded in 2020 by Daniel and Sebastian Schall, Black Semiconductor has rapidly evolved within the semiconductor industry, securing significant funding—including €254.4 million in our latest financing round. Our new facility, FabONE, serves as a cornerstone for scalable production, enabling the realization of innovative chip connectivity solutions that will drive future technology advancements, particularly in sectors like generative AI. Our committed vision emphasizes technological excellence, financial sustainability, and fostering an environment conducive to creativity and growth in our workforce, ensuring our solutions make a meaningful impact on the global stage.

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Black Semiconductor

Company size

51-200 employees

Founded in

2020

Chief executive officer

Daniel Schall

Markets

SemiconductorsPhotonicsGraphene TechnologyAdvanced MaterialsHigh Performance ComputingArtificial Intelligence HardwareChip ManufacturingData Center InfrastructureTelecommunications HardwareEnergy Efficient Computing

Employees live in

Germany
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