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Warren BWB
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Warren B

@warrenb

RF power product development engineer who advanced transistor and amplifier designs at MACOM, Wolfspeed, and NXP Semiconductors.

United States
Message

At MACOM, I continued in product development and team leading after the company purchased Wolfspeed RF. At Wolfspeed, I started a new product design team at the Mesa design center and contributed to technical designs and simulations.

At NXP Semiconductors, I was lead designer and technical manager for LDMOS transistor development for HF to S-Band applications outside of Infrastructure. My work included 50V die technology selection, product definition, and portfolio design; my broader design experience includes solid state power amplifiers and LDMOS and GaN transistor chip-and-wire design.

Experience

Work history, roles, and key accomplishments

MA

Senior Product Development Manager

MACOM

Dec 2023 - Sep 2025 (1 year 9 months)

Macom purchased Wolfspeed RF in December of 2023. Continued in product development, team leading.

Wolfspeed logoWO

RF Power Transistor Product Development Manager

Nov 2018 - Dec 2023 (5 years 1 month)

Started new product design team at the Mesa design center. Involved in technical designs, simulation, mentoring, and team leading.

NXP Semiconductors logoNS

Principal Staff Engineer

Jan 2005 - Nov 2018 (13 years 10 months)

Lead designer/technical manager for LDMOS transistor development for HF to S-Band frequencies for various applications outside of Infrastructure. Responsible for 50V die technology selection, product definition, product portfolio design, and team leading. Device power levels range from 10 Watt to 1000 Watts.

RA

Staff Design Engineer

RF Micro Devices, Chandler Design Center, Chandler AZ

Jan 2004 - Jan 2005 (1 year)

Member of a design team developing front-end modules for the subscriber market. Specific design tasks included a 2.1 GHz, 23 dBm power amplifier module which also included filters, a coupler, and control circuitry, with low and high power modes. This projects detailed tasks included die layout, multi-layer laminate design and layout, and the associated test required for WCDMA modules.

FI

Principle Staff Engineer

Freescale Semiconductor/Motorola Inc

Jan 1997 - Jan 2004 (7 years)

Worked as Principle Staff Engineer at Freescale Semiconductor/Motorola Inc.

BE

Senior RF Engineer

Broadcast Electronics

Jan 1994 - Jan 1997 (3 years)

Involved in the designing, testing and manufacturing support of a 10-way/8-way RF power divider for use in a 5kW/4kW FM broadcast transmitter. The design of three separate VHF power amplifiers for use in FM broadcast transmitters. Other tasks include solving various RF circuit manufacturing problems, filter design, directional coupler design, VSWR and temperature testing of FM transmitters, and pr

AC

Senior Engineer

Allied-Signal Aerospace Company

Jan 1989 - Jan 1994 (5 years)

Worked as Senior Engineer at Allied-Signal Aerospace Company.

Education

Degrees, certifications, and relevant coursework

UI

University of Idaho

MSEE, RF/Microwaves

UI

University of Idaho

BSEE, RF/Microwaves

BU

Boise State University

General Engineering

Tech stack

Software and tools used professionally

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