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Nick Kakenov

@nickkakenov

I build and validate high-speed electronic boards for test, transit, defense, and automotive platforms.

United States
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What I'm looking for

I'm looking to apply my board-level design, validation, and sustaining-support experience to high-performance server, datacenter, and accelerator platforms.

At Teradyne, I own board-level design for automated electronic test platforms, translating product requirements into schematics, power trees, component selections, and prototype plans. I reduced tester debug cycles by 30% by standardizing bring-up checklists, rail measurements, failure signatures, and firmware-hardware handoff documentation.

Previously at Luminator Technology Group, I designed embedded controller and passenger-information electronics for transit buses and rail vehicles, cutting first-pass hardware issue closure from four weeks to three. At BAE Systems and Aptiv, I developed and validated ruggedized defense and automotive electronic hardware while improving prototype fault isolation and reducing recurring bench rework.

I take boards from circuit definition through lab validation, production release, and sustaining support, working across processor, FPGA, Ethernet, PCIe, USB, CAN, and power-conversion interfaces. My work combines schematic capture, multilayer PCB design, SI/PI review, board bring-up, and failure analysis for high-performance hardware platforms.

Experience

Work history, roles, and key accomplishments

Teradyne logoTE
Current

Senior Hardware Design Engineer

Jul 2023 - Present (3 years 2 months)

Owns board-level design for automated electronic test platforms, leading schematic capture, PCB definition, and design validation. Reduced tester debug cycles by 30% by standardizing bring-up checklists and documentation.

Luminator Technology Group logoLG

Hardware Design Engineer

Mar 2020 - Jun 2023 (3 years 3 months)

Designed embedded controller and passenger-information electronics for transit buses and rail vehicles. Cut first-pass hardware issue closure time from 4 weeks to 3 weeks by introducing structured interface checkouts and boundary-condition testing.

BAE Systems logoBS

Electronics Design Engineer

Jan 2019 - Feb 2020 (1 year 1 month)

Developed ruggedized electronic assemblies for defense and security systems, supporting requirements analysis, circuit design, PCB implementation, and prototype testing. Improved prototype fault isolation by 25% through repeatable power-on procedures and structured failure-analysis reports.

Aptiv logoAP

Hardware Engineer

Jun 2016 - Dec 2018 (2 years 6 months)

Supported design and validation of automotive electronic control hardware for connected and automated vehicle systems. Reduced recurring bench rework by 20% by documenting assembly constraints, probe locations, and common power-up failure modes.

Education

Degrees, certifications, and relevant coursework

Bilkent University logoBU

Bilkent University

Ph.D, Electrical and Electronics Engineering

2012 - 2016

Ph.D in Electrical and Electronics Engineering from Bilkent University from 2012 to 2016.

Bilkent University logoBU

Bilkent University

Master's Degree, Electrical and Electronics Engineering

2010 - 2012

Master's Degree in Electrical and Electronics Engineering from Bilkent University from 2010 to 2012.

Middle East Technical University logoMU

Middle East Technical University

Bachelor's Degree, Electrical and Electronics Engineering

2006 - 2010

Bachelor's Degree in Electrical and Electronics Engineering from Middle East Technical University from 2006 to 2010.

Tech stack

Software and tools used professionally

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