Open to opportunities

Ooi CK

@ooick

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Award-winning engineer specializing in thermal and mechanical design.

Malaysia

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What I'm looking for

I seek a role that fosters innovation and collaboration, with opportunities for leadership and technical growth.

I am a seasoned Senior Staff Technology Development Engineer with extensive experience in thermal, fluid, and mechanical engineering. My journey at Intel Technology Sdn Bhd has been marked by significant achievements, including being honored with the prestigious 2023 iNEMI Project Leadership Award for my work on High Density Interconnect (HDI) Socket Warpage Prediction and Characterization. I have also been recognized as a top performer within the organization, receiving multiple awards for my innovative contributions to semiconductor and packaging process development.

With a strong foundation in Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD), I have led cross-functional teams in advanced simulation technology development and project management. My technical expertise is complemented by my ability to foster collaboration across various departments and sites, ensuring successful project execution and alignment with Intel's strategic goals. I am passionate about mentoring and sharing knowledge, having authored over 50 technical journals and served as a technical panel member for numerous conferences.

Experience

Work history, roles, and key accomplishments

Current

Senior Staff Technology Development Engineer

Current

Intel Technology Sdn Bhd

Jan 2012 - Present (13 years 6 months)

Led special projects on immersion cooling solutions for high TDP servers and high-performance desktops. Managed advanced simulation technology pathfinding and roadmap development for flip-chip packaging and process characterization.

Thermal Design Power (TDP)Immersion Cooling Process Characterization Simulation

Sr. R&D Engineer

Intel Technology Sdn Bhd

Jan 2007 - Dec 2012 (5 years 11 months)

Pioneered advanced modeling physics and developed new core competencies for flip-chip assembly processes. Developed and deployed complex multiphase free surface flow modeling capabilities to the US R&D headquarters.

Multiphase Flow Modeling Root Cause Analysis Process Development

Mechanical R&D Engineer

Intel Technology Sdn Bhd

Jan 2004 - Dec 2007 (3 years 11 months)

Conducted thermal design, characterization, and analysis for electronic packages using FEA and CFD tools like Ansys, Icepak, and Flotherm. Performed stress and warpage analysis for packaging to meet SMT JEDEC specifications.

CFDs Icepak FLOTHERM Stress Analysis Warpage Analysis

Process/Module Engineer

Intel Technology Sdn Bhd

Jan 2003 - Dec 2004 (1 year 11 months)

Responsible for new process quality monitoring development for TRES (Thermal Resistance Evaluation System). Performed MCA, IQ, and cross-site matching for TRES development and deployment across virtual factories.

TRES Recipe Development

Education

Degrees, certifications, and relevant coursework

University Science of Malaysia (USM)

Professional Degree, Mechanical Engineering

Grade: 2nd Class Upper (CGPA: 3.57 /4 )

Completed a Professional Degree in Mechanical Engineering, achieving a 2nd Class Upper with a CGPA of 3.57/4.0. This program provided a strong foundation in mechanical engineering principles.

University Science of Malaysia (USM)

Master’s Degree, Mechanical Engineering

Grade: 1st Class/A

Focused on advanced topics in Mechanical Engineering, specializing in FEA (Finite Element Analysis), Thermal & Heat Transfer in Electronic Packaging. Graduated with a 1st Class/A grade.