Harvey Ferrer

Lead APAC after-sales technical operations covering partner capability, repair-center readiness, technical escalations, warranty and RMA workflows, and field-quality investigations. Coordinate with R&D, Quality, EMS partners, suppliers and regional service providers to isolate failures and drive corrective actions.

Performed advanced inspection, testing, and authentication of electronic components using X-ray, XRF, decapsulation, and electrical testing to identify quality concerns and potential counterfeit devices. Conducted package-level failure analysis on semiconductor components including BGA, QFP, and TSOP devices and prepared detailed technical investigation reports.

Built, reworked and validated more than 50 functional printer prototypes; performed reliability testing, firmware updates, teardown analysis and equipment repair in collaboration with R&D engineers.

Built, reworked, and validated more than 50 functional printer prototypes; performed reliability testing, firmware updates, teardown analysis, and equipment repair in collaboration with R&D engineers.

Investigated over 700 complaints involving Abbott Point of Care i-STAT medical devices within an ISO 13485-regulated quality environment. Developed Failure Analysis Plans, reviewed Device History Records and test data, assessed complaint trends, and prepared formal investigation reports for independent Product Quality Assurance review.

Performed PCBA failure analysis and component-level repair, including BGA replacement; developed motherboard troubleshooting guides and trained repair technicians in diagnostics and electronic test equipment.

Led APAC technical-quality escalations, coordinated engineering corrective actions, and supported field testing, repair-quality improvement, and regulatory Type Approval activities.

Delivered component-level electronics repair training and authored troubleshooting documentation for regional service partners across Asia. Performed advanced PCBA diagnostics and failure analysis using ICT incorporating Boundary Scan to isolate defective circuitry and components.

Troubleshot and repaired high-volume SMT-line PCBA fallout using schematics and BOMs; fed recurring defect findings back to SMT process engineers for corrective action and recurrence prevention.

IPC-A-610 Certified Trainer with seven years of trainer experience.

Bachelor of Science in Aviation Electronics and Communication Engineering from PATS College of Aeronautics.