Hadi Boustani

Directed high-level technology strategy and roadmaps, end-to-end R&D of Organ-on-Chip platforms, automated microfluidic systems and biomedical hardware. Led multidisciplinary engineering teams through prototype iterations, mechanical testing, biological experiments, and production scaling.

Led technical vision, engineering operations, and multi-disciplinary project execution for custom automated solutions. Conceptualized and engineered a first-of-its-kind automated fresh-food vending machine, managing full-lifecycle mechanical design, electronics integration, and manufacturing quality control.

Engineered heavy-duty high-speed packaging machinery, custom automated conveyor networks, and specialized automation equipment. Led end-to-end engineering projects from conceptual CAD modeling through FEA structural analysis, motion calculations, and deployment.

Designed a 5-Axis Waterjet Pipe Fitting Cutting Machine including 3D CAD assemblies, detailed execution drawings, and structured Bills of Materials. Provided direct shop-floor supervision during manufacturing and physical assembly.

Engineered advanced 3D FEA models (Abaqus/Ansys) to simulate stress distribution and displacement in spinal implants. Executed probabilistic, sensitivity, and structural optimization analyses using specialized software to refine implant mechanics.

Designed heat-welding stamping equipment for microchip production.

Participated in quality control and production tracking workflow database design.

Master of Science in Mechanical Engineering from Technical University of Berlin, completed in May 2009.

Lebanese Baccalaureate in Mathematics from German School Beirut, completed in July 2000.