Open to opportunities

Bhuvana Manjunath

@bhuvanamanjunath

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Lead PCB/PWB design engineer with 20+ years delivering high-speed, EMI-compliant boards and guiding teams end-to-end.

India

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What I'm looking for

I’m looking to lead end-to-end high-speed PCB/PWB design for complex boards, working closely with SI, hardware, and manufacturing. I want opportunities to drive DFM/DFT, improve yield, and mentor teams while owning customer-facing proposals and delivery.

I’m a result-driven Lead PCB/PWB Design Engineer with 20+ years of end-to-end experience building high-speed, high-density, and EMI-compliant PCB layouts for automotive, aerospace, telecom, medical, and industrial applications. I own the full board development flow—from schematic to Gerber release and manufacturing interfaces—bringing Cadence Allegro/OrCAD (18+ yrs) and Altium Designer (6+ yrs) into every phase, with a strong focus on SI/PI-critical routing and robust interconnect design.

As a technical lead and single point of contact, I partner with SI, hardware, validation, and mechanical teams to define feasibility, timelines, and risks, and I lead design kick-off and milestone reviews. I coordinate DFM/DFA with PCB vendors and EMS partners, validate BOM/manufacturing packages (including Gerber and ODB++ outputs), and drive yield improvement initiatives—while mentoring teams of 6–8 engineers and training juniors. My work spans DDR4/DDR5, PCIe Gen4/Gen5, 10G/25G/100G Ethernet, USB4/Type-C, SerDes, JESD204B, MIPI CSI/DSI, eMMC/SDIO, plus stack-up planning, backdrilling, microvia stacking, via-in-pad, and simulation-first routing using HyperLynx and Sigrity.

Experience

Work history, roles, and key accomplishments

Current

Lead Engineer - PCB

Current

Quest Global

Feb 2024 - Present (2 years 3 months)

Led the end-to-end design of automotive PCBs, coordinating stack-up/3D integration and reviewing manufacturing packages including BOM validation, Gerbers, and ODB++ outputs. Interfaced with PCB vendors and EMS partners to drive DFM/DFA and yield improvement initiatives, supporting proposal estimation and resource planning.

High Speed SI PI HyperLynx Stack Up Impedance Planning PCIe DFM

Lead PCB Design Engineer

Oivi And Eldaas

Mar 2020 - Jan 2024 (3 years 10 months)

Delivered turnkey PCB design solutions across defense, RF, medical, power, and automotive domains, from schematic capture through Gerber generation. Collaborated with PCB vendors and EMS partners on DFM/DFA initiatives and trained junior engineers.

Schematic Capture SI PI Coordination DFM Microvia Via In Pad Design Stack Up And Materials Planning DDR4 DDR5 Routing Concepts PCIe SerDes Constraint Support

Module Lead PCB Design

Eximius Design Pvt Ltd

Aug 2018 - Feb 2020 (1 year 6 months)

Provided module-level ownership for multi-board telecom and wireless systems, designing multi-layer high-speed PCBs. Worked with U.S.-based customers for timing/routing sign-off and coordinated with PCB vendors and EMS partners on DFM/DFA and yield improvements.

DDR4 SGMII High Speed Differential Routing High Speed SI Coordination DFM

Education

Degrees, certifications, and relevant coursework

Cadence

Diploma in Electronics and Telecommunication, Electronics and Telecommunication

1992 - 1997

Completed a Diploma in Electronics and Telecommunication from Cadence. Focus included Allegro/OrCAD tooling experience mentioned alongside the education details.