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NXP SemiconductorsNS

System IC Architect - Advanced Power Systems

NXP Semiconductors N.V. is a global semiconductor company providing secure connectivity solutions for embedded applications in the automotive, industrial & IoT, mobile, and communication infrastructure markets.

NXP Semiconductors

Employee count: 5000+

United States only

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Department: Advanced Power Systems (APS). This role emphasizes Advanced Power Management System IC Architecture for Point of Load (PoL) solutions.

Role Overview

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration.

We’re looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

Key Responsibilities – Advanced Power Management & System IC Architecture

Product Definition & Strategy

  • Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
  • Translate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Support development through thermal optimization and electrical analysis.

System-Level Integration

  • Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
  • Lead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.
  • Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued.

Thermal Management & Advisory

  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.

Cross-Functional Leadership

  • Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs.
  • Act as a technical liaison with customers, supporting co-development and design-in activities.

Technical Advisory & Reporting

  • Provide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Report KPIs and project status to executive stakeholders.

Preferred Qualifications – Power Semiconductor Architect Expertise

  • Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
  • 15+ years of experience in power semiconductors, packaging, and system-level integration. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.
  • Proven track record in product definition through revenue realization.
  • Strong expertise in thermal management, electrical performance, and advanced reliability.
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.
  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).
  • Demonstrated ability to lead cross-functional, global teams and manage complex projects.
  • Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
  • Creative mindset with strong problem-solving capabilities.

• Willingness to travel globally.

Location:

This position is located in Chandler, AZ. It is NOT open to 100% remote. This is a hybrid role with 3 days in office and 2 days WFH each week.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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About NXP Semiconductors

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NXP Semiconductors N.V. is a global semiconductor company that enables a smarter, safer, and more sustainable world through innovation. Our customers in the automotive, industrial & IoT, mobile, and communication infrastructure markets rely on us to deliver secure connectivity solutions for embedded applications. We are pushing boundaries in these sectors, built on more than 60 years of combined experience and expertise. Many businesses and consumers face challenges in an increasingly connected world, from ensuring the security of their data and devices to managing the complexities of integrating diverse technologies. NXP addresses these challenges by providing a comprehensive portfolio of products, including microcontrollers, application processors, communication processors, connectivity chipsets, analog and interface devices, RF power amplifiers, security controllers, and sensors. Our solutions are designed to make lives easier, better, and safer by enabling devices to sense, think, connect, and act intelligently.

Our focus is on creating breakthrough technologies that solve real-world problems for our customers. For instance, in the automotive sector, our innovations are pivotal in developing secure connected vehicles, advancing autonomous driving, and enhancing in-vehicle experiences. In the industrial and IoT space, we provide robust and secure solutions that enable smart cities, smart homes, and efficient industrial automation. Mobile device manufacturers utilize our technologies for secure payment solutions and enhanced connectivity. Furthermore, our products form the backbone of communication infrastructure, supporting the rollout of next-generation networks like 5G. We understand that our customers need reliable, high-performance, and secure semiconductor solutions to succeed in their respective markets. That's why NXP is committed to continuous research and development, investing heavily to stay at the forefront of technological advancements and to meet the evolving needs of a digitally enhanced world that anticipates and automates.

Employee benefits

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Relocation support

Offered if necessary. [22]

Vision Insurance

Vision care benefits. [19, 21]

Additional vacation days

Offered in some locations. [22]

Maternity & Paternity leave

Paid leave for new parents. [36]

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NXP Semiconductors

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