Rajitha Harikrishnan
@rajithaharikrishnan
Firmware Engineer improving SSD performance, reliability, and thermal management.
What I'm looking for
I’m a Firmware Engineer with 2+ years of experience in SSD firmware development, specializing in NVMe, Host Interface Layer, thermal management, and NAND reliability. I focus on improving performance, ensuring data integrity, and automating engineering workflows in large-scale storage systems.
In my current role as Senior Engineer, I’m the Module Owner – Thermal Management, driving a performance-critical subsystem that impacts SSD throughput, reliability, and device lifespan. I develop and maintain C++ firmware in the NAND layer, and I use Trace32 (T32) and Visual Studio to root cause issues and keep storage systems dependable. I also design and maintain build environments, improving development efficiency and consistency across firmware builds, and I built an automation tool to generate guide files that reduced manual effort by ~85%.
Earlier, as a Research Intern at Samsung Semiconductor India Research, I worked in the Host Interface Layer and contributed to feature development using the MCTP protocol. I strengthened my NVMe expertise through high-performance storage work, developed a C/C++ feature that reduced project cost by 90%, and supported knowledge-sharing through seminars and workshops. Beyond engineering, I’ve led student technical initiatives—organizing workshops and mentoring 30+ people—which shaped my hands-on, collaborative approach to building reliable systems.
Experience
Work history, roles, and key accomplishments
Senior Firmware Engineer
Samsung Semiconductor India Research
Aug 2023 - Present (2 years 10 months)
Owned a performance-critical SSD thermal management module that impacts throughput, reliability, and device lifespan. Developed and maintained C++ NAND-layer firmware and build environments, and built an automation tool that reduced manual developer effort by ~85%.
Research Intern
Samsung Semiconductor India Research
Jan 2023 - Jul 2023 (6 months)
Worked on the Host Interface Layer, contributing to feature development using the MCTP protocol and building expertise in NVMe technology. Developed a C/C++ feature that reduced project cost by 90%.
Education
Degrees, certifications, and relevant coursework
Manipal Institute of Technology
Bachelor of Technology (B.Tech), Computer and Communication Engineering
2019 - 2023
Grade: 7.78/10
B.Tech in Computer and Communication Engineering at Manipal Institute of Technology (2019–2023). Coursework included Discrete Mathematics, Calculus, Operating Systems, and Data Structures & Algorithms; GPA 7.78/10.
Tech stack
Software and tools used professionally
Availability
Location
Authorized to work in
Job categories
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