At HCL Technologies, I work on mechanical and electromechanical development of Test Head Unit modules for semiconductor memory test equipment. For Teradyne, I develop 3D harness routing models and pegboard drawings, and design sheet metal components with manufacturing requirements in mind.
For Applied Material, I contributed to semiconductor equipment development using Siemens NX and Teamcenter PLM. I led engineering data classification and standardization initiatives, and achieved approximately USD 15K in cost savings through design reuse and duplicate-part elimination.
I’ve also designed vehicle structures and assemblies at Onward Technologies Ltd-Bengaluru (DTICI) and ParamTech CAD Service pvt ltd.Dharwad. My work includes product data and change control, tolerance stack-up analysis, and engineering documentation; I’m also pursuing an AI-Powered Product Design & Management certification from IITM Pravartak.

