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Dinesh SaravananDS
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Dinesh Saravanan

@dineshsaravanan

Software Engineer at HARMAN International contributing to a Flask tool that cut manual requirement-intake effort by approximately 60%.

India
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At HARMAN International, I contribute to a Python and Flask-based CRS Intake Tool that turns unstructured customer documents into structured requirement data for IBM DNG. I helped reduce manual requirement-intake effort by approximately 60% while validating the workflow with customer documents.

I designed and implemented hybrid document processing that uses DocLayout-YOLO to assess page layouts, routes simpler pages to native Python parsers, and uses Docling for complex or mixed layouts. I also added extraction checks and fallback routing for failed or low-quality results.

In my earlier HARMAN role, I analyzed customer specifications and translated them into system-level requirements for automotive HMI and ECU functions. I led a five-member HMI requirements team and worked on requirements covering CAN communication, UDS diagnostics, and ECU interfaces.

I also develop Python utilities for requirement comparison, duplicate detection, and validation reporting. My systems engineering background includes automotive feature modeling with SysML/MBSE and experience with IBM DNG and Enterprise Architect.

Experience

Work history, roles, and key accomplishments

HARMAN International logoHI
Current

Engineer 1 - Solutions Architecture

Jan 2026 - Present (9 months)

Contribute to a Python/Flask-based CRS Intake Tool for automated customer requirement ingestion, document processing, validation, and structured downstream use in IBM DNG. Designed and implemented a hybrid document-processing pipeline using DocLayout-YOLO and Docling, and improved processing strategy to reduce manual effort by approximately 60%.

Education

Degrees, certifications, and relevant coursework

PR

PSG Institute of Technology and Applied Research

Bachelor of Engineering, Electrical Engineering

2019 - 2023

Grade: 9.06 CGPA

Bachelor of Engineering in Electrical Engineering from PSG Institute of Technology and Applied Research, completed from 2019 to 2023 with a CGPA of 9.06.

Tech stack

Software and tools used professionally

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