Taiwan onlyAbout Lyte AI
- Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
- We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.
What you'll do
- Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture
- Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
- Project tracking weekly.
- Write technical reports and present results.
- Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use.
- Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
- Maintain the software and firmware support for testing and relevant setups.
Required Qualifications
- Minimal requirement is a bachelor's degree with 1 years of experience.
- The successful candidate need have English communication capability.
- Experience or knowledge of PCB assembly with SMT line
- Hands-on experience in laboratory experimentation and data analysis
- English communication capability is a must.
- Familiar with Microsoft Office.
- Fast learner is a must.
- Good work ethics and Maintain company confidential information are a must
Preferred Qualifications
- Higher degree with more experience is highly desired.
- Experience with microelectronic device packaging.
- Former experience of optical device packaging is highly desirable.
- Experience with hands-on testing of photonic and electronic. device/components.
- Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
- Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in SolidWorks and familiar with Engineering drawing is a plus.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills are desired eg. python, or C++
- Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
- Experience in microsystem assembly such as hard disk assembly is a plus.
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
United States
Poland only
AF, AM + 49 more
