R Anand

I built EcopackAI during my Software Engineer internship with Infosys Springboard, creating an AI system that recommends sustainable packaging materials to optimize cost and environmental impact.

I trained and examined machine-learning models, then developed a full-stack solution with Docker-based deployment for scalability. The model can reduce packaging costs by 10%–25% and CO2 emissions by up to 30% based on selected parameters.

My project work also includes a fantasy cricket application for creating and managing virtual teams, along with IoT-based hand-gesture-controlled LED lights for touchless interaction.

I've also developed an IoT-based MEMS landslide detection system to monitor conditions and provide real-time warnings. I work with Python and C, and bring communication, leadership, time management, and presentation skills to my work.