善垣 吳
@0003850
Quality-focused engineer bridging semiconductor equipment validation and materials R&D for advanced packaging processes.
TaiwanWhat I'm looking for
I’m an engineer with four years of combined experience, including two years in semiconductor equipment and component quality engineering and two years in materials R&D. I’ve worked across equipment functional validation, vacuum component quality control, materials NPI, and process optimization—using DOE and SPC to improve manufacturability and yield.
My graduate research focuses on electrochemistry, copper electroplating, TSV/TGV, glass substrate, and Cu-Cu hybrid bonding for advanced packaging. I built an EIS-based framework linking electroplating additives, interfacial kinetics, and Cu microstructure—reducing hybrid bonding temperature 40%—and collaborated with the University of Pennsylvania on high-AR glass-substrate metallization and Cu filling for TGV applications. I’ve published two Journal papers on Cu electroplating and advanced-packaging process monitoring, presented at ICMCTF 2026, and earned a Micron Memory Award project for an EIS-based diagnostic approach to plating-bath aging and waste reduction.
Experience
Work history, roles, and key accomplishments
Manufacturing-Supplier Quality Engineer
Lam Research
Jan 2021 - Jan 2023 (2 years)
Qualified vacuum modules and chamber components and performed outgoing functional validation before shipment. Led supplier quality improvement using 8D/RCCA.
R&D Assistant
Fu Sheng Industrial Co., Ltd
Jan 2017 - Jan 2019 (2 years)
Conducted materials R&D, pickling-process development, and NPI validation. Led alternative-material qualification during a supplier disruption using DOE and SPC, preventing production interruption and improving yield from 94% to 97%.
Education
Degrees, certifications, and relevant coursework
National Taipei University of Technology
Master of Science, Semiconductor Materials & Fabrication
2024 - 2026
Activities and societies: Collaborated with University of Pennsylvania (high-AR glass-substrate metallization, Cu filling for TGV); Micron Memory Award: EIS-based diagnostic for plating-bath aging/waste reduction; published two journals on Cu electroplating/advanced-packaging monitoring; presented at ICMCTF 2026.
M.S. in Semiconductor Materials & Fabrication at National Taipei University of Technology, researching electrochemistry for copper electroplating and Cu-Cu hybrid bonding for advanced packaging. Collaborated with the University of Pennsylvania on high-AR glass-substrate metallization for TGV and developed an EIS-based model that reduced hybrid-bonding temperature by 40%.
National Taipei University of Technology
Bachelor of Science, Mechanical Engineering
2016 - 2021
B.S. in Mechanical Engineering from National Taipei University of Technology (2016–2021).
Availability
Location
TaiwanAuthorized to work in
Job categories
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