United States onlyAbout Voyant Photonics
Voyant Photonics is redefining machine perception with compact, high-performance LiDAR devices that fit in the palm of your hand. Leveraging cutting-edge silicon photonic chips, our sensors deliver unparalleled accuracy in range, velocity, and reflectivity, at a fraction of the cost of traditional LiDAR systems. By transforming high-precision sensing into an accessible technology, we are enabling new applications in robotics, autonomous systems, industrial automation, and beyond.
At Voyant, we are not just building products, we are advancing an industry. Our breakthrough technology bridges the gap between research and real-world deployment, making high-performance LiDAR scalable and commercially viable.
The Opportunity
Voyant Photonics is seeking an exceptional Principal Mixed-Signal ASIC Engineer to architect and build the custom silicon that forms the electronic backbone of our FMCW LiDAR systems. This is a rare, ground-floor opportunity to establish and own Voyant’s ASIC development program defining the architecture, tools, processes, and technical direction while delivering production silicon that directly enables our product roadmap.
Reporting to the executive technical leadership team, you will drive silicon development from concept through volume production, working at the intersection of mixed-signal IC design, silicon photonics, systems engineering, and manufacturing. This role offers extraordinary technical scope and ownership: you will drive the ASIC strategy, lead architecture and implementation, manage external design partners as needed, and eventually build and lead an internal team as the program scales.
This position is initially deeply hands-on (expect >80% of your time in real IC design work), with a natural evolution into technical leadership and team-building as Voyant grows. You will collaborate closely with world-class photonics, systems, and hardware engineers to create breakthrough silicon that powers a new generation of compact, high-performance LiDAR sensors.
If you’re excited by the idea of owning the entire silicon stack, from first architecture discussions to working production chips in the field and want to have outsized technical impact at a fast-growing deep-tech company, this role is a once-in-a-career opportunity.
Location: Ideally based in New York City. We offer relocation assistance and are open to remote arrangements, with periodic travel to the NYC office for collaboration and team alignment.
Responsibilities:
Drive mixed-signal ASIC development from concept and architecture through tape-out, silicon bring-up, and production across multiple technology nodes (130 nm and below, including BCD processes).
Design ultra-low-noise analog front ends, including transimpedance amplifiers (TIAs) achieving low pA/√Hz noise performance.
Develop mixed-signal circuits including amplifiers, ADCs, DACs, clocking, and power management blocks that interface directly with silicon photonic ICs.
Establish the ASIC development environment: select and deploy EDA tools, define design flows, and set standards for verification and validation.
Collaborate closely with photonics designers, systems engineers, and FPGA/digital teams to drive tight electronic–photonic co-design and system-level optimization.
Define overall ASIC architecture and partitioning between custom silicon and external components; make critical decisions on process, IP, and design-for-manufacturing.
Provide architectural guidance and HDL input to external digital design partners (you will not own advanced-node P&R, but you will define requirements and review implementations).
Hire and mentor a small, high-caliber team of analog and digital IC designers as the program scales.
Qualifications
7+ years of experience in analog and mixed-signal IC design with an 80/20 analog-to-digital focus
Proven track record leading multiple tapeouts from concept to production silicon
Deep expertise in low-noise analog circuit design, particularly transimpedance amplifiers or similar precision front-end circuits
Knowledge of test plan development for analog ASICs at OSAT partners
Strong understanding of mixed-signal design: ADCs, DACs, bias circuits, and power management
Experience working in both mature nodes and interfacing with advanced node digital design
Ability to hit the ground running: we need working silicon in 9-12 months
Excellent communication and collaboration skills. you'll work across disciplines daily
Preferred Qualifications
Experience with photonic IC co-design or interfacing analog circuits with optical components
Knowledge of advanced packaging techniques (chiplets, heterogeneous integration, 2.5D/3D)
Background in design-for-manufacturability
Understanding of commercial IP ecosystems, build vs buy tradeoffs, selection, and license negotiation
What We Offer
Competitive salary and meaningful equity package
Comprehensive health benefits (Medical, Dental, Vision)
Unlimited PTO and paid company holidays
Team events and company meetups
Hybrid or remote work environment with monthly travel for remote employees.
Complimentary lunch provided daily at our NYC office
Compensation & Benefits
Competitive salary and meaningful equity package
Comprehensive health benefits (Medical, Dental, Vision)
Unlimited PTO and paid company holidays
Flexible work environment (Hybrid or remote with travel)
Team events and company meetups
Complimentary lunch provided daily at the office
Equal Opportunity Employer
Voyant Photonics is an equal opportunity employer committed to building a diverse and inclusive workplace. We welcome applicants from all backgrounds and do not discriminate based on race, color, religion, gender, gender identity or expression, sexual orientation, pregnancy, marital or partnership status, age, national origin, citizenship, veteran or military status, disability, medical condition, genetic information, caregiver status, or any other characteristic protected by law.
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